Development of Embedded Device Package, MCeP^® (Molded Core embedded Package)

Core-selecting package auctions

Auctions that select core allocations with respect to reported values generate competitive levels of sales revenues at equilibrium and limit bidder incentives to use shills. Among core-selecting auctions, the ones that minimize seller revenues also maximize incentives for truthful reporting, produce the Vickrey outcome when that lies in the core and, in contrast to the Vickrey auction, and crea...

Investigation of Warpage Induced on Molded Strip of Qfn Package

Warpage is known to be one of the primary molding issues during assembly of QFN package. It affects the package sawing process, and cause reliability issues. The main cause of warpage of area array packages is the coefficient thermal expansion (CTE) mismatch between the moulding compound and other components inside the package. The objective of this study is to investigate the warpage induced o...

Beyond Embedded Device

In the recent years, technology advances in sensors and image processing have allowed significant improvements that encompass not only quality, but also image content analysis and understanding. Consumer devices are now being equipped with sophisticated algorithms allowing complex tasks such as face recognition, smile detection, automatic red eye removal, etc. In addition, topics related to ima...

Embedded Multi-core Processors

Designing multi-threaded and multi-core processor architectures has become one of the most challenging projects for computer scientists in the last few years. But not only the design of such architectures for desktop computers, servers, or high performance computing (HPC) clusters has been investigated in a sophisticated manner, also in the area of embedded systems, researchers have started to ...

Testing Medical Device and Package Integrity